The goal of this activity is to get the best simulation parameters to use in our phone drop test FE models.
The models are oriented, among other things, to the evaluation of the failures that can occur in one or more solder joints of a particular electronic device called BGA (Ball Grid Array) during a phone impact.
The solder joints are used to anchor the device at his support and electrically connect the internal active circuits to the copper traces present inside the layers of this support called PCB (printed circuit board).
The activity is based on the correlation between the data coming from dynamic tests performed on specimens designed on purpose and simulation results.
Hence, the activity is divided in two main steps: PCB material characterization and BGA solder joints simulation parameters identification.
This was necessary because the specimen used in the second test is composed by a BGA mounted on a bare PCB: a wrong material for the board could lead to unreliable results for the solder joints characterization.
Has to be noted that the dimensions of these solder joints (about 0.2mm) doesn't permit to get information with a direct test on them.
The optimization integrated platform (modeFRONTIER) used for the activity has permitted to obtain good results rapidly and will become part of the characterization methodology implemented in production. |
